scope:

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial and industrial applications.

This section discusses general recommended assembly guidelines. Later sections discuss information concerning specific packaging types.

Sections 2 through 5 provide guidelines for the specific component within each sectional document. The parts are described in detail and each section outlines specifics affecting the part class. The descriptions and classifications provided are those generally used in the industry with reference to military and commercial applications.

Due to the rapid progress and evolution in packaging and assembly technology today, this document may not cover all currently available components or assembly techniques such as lead free.