scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and H) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-H-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 8K × 8-bit PROM 55 ns 02 8K × 8-bit PROM 45 ns 03 8K × 8-bit PROM 35 ns 04 8K × 8-bit PROM 25 ns 05 8K × 8-bit PROM 55 ns 06 8K × 8-bit PROM 45 ns 07 8K × 8-bit PROM 35 ns 08 8K × 8-bit PROM 25 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1815 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range to ground potential (V_CC) . . . . . −0.5 V dc to +7.0 V dc DC voltage applied to the outputs in the high-Z state . . −0.5 V dc to +7.0 V dc DC input voltage . . . . . . . . . . . . . . . . . . . . −3.0 V dc to +7.0 V dc DC program voltage . . . . . . . . . . . . . . . . . . . 13.0 V dc Maximum power dissipation . . . . . . . . . . . . . . . . 1.0 W 2/ Lead temperature (soldering, 10 seconds) . . . . . . . . +260°C Thermal resistance, junction-to-case (θ_JC) . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C Storage temperature range (T_STG) . . . . . . . . . . . . −65°C to +150°C

Supply voltage (V_CC) . . . . . . . . . . . . . . . +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) . . . . . . . . . . . . . . . 0 V dc Input high voltage (V_IH) . . . . . . . . . . . . . 2.0 V dc minimum Input low voltage (V_IL) . . . . . . . . . . . . . . 0.8 V dc maximum 3/ Case operating temperature range (T_C) . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 4/

intended Use: