DS/EN 61190-1-1
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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| Organization: | DS |
| Publication Date: | 9 July 2002 |
| Status: | active |
| Page Count: | 27 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
Document History
DS/EN 61190-1-1
July 9, 2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux...
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