scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6). Two product assurance classes, military high reliability (device classes B, Q, or M) and space application (device classes S or V) and a choice of case outlines and lead finishes are available and are reflected in the complete part number. Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the complete part number.

The PIN shall be as shown in the following example:

Device classes M, B, or S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q or V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 CY7C331-40 Asynchronous Registered PLD 40 ns 02 CY7C331-30 Asynchronous Registered PLD 30 ns 03 CY7C331-25 Asynchronous Registered PLD 25 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, or S case outlines shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q or V, case outlines shall meet the requirements of MIL-I-38534, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X See figure 1, (28-lead, 1.485" × .310" × .200"), dual-in-line package Y F-11 (28-lead, .740" × .380" × .090"), flat package Z See figure 2, (28-lead, .458" × .458" × .180"), J-leaded chip carrier 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, or S or MIL-I-38535 for classes Q or V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference.

Supply voltage to ground potential - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs in High Z state - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc Maximum power dissipation 2/ - - - - - - - - - - 1.2 W Lead temperature (soldering, 10 seconds) - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Case outlines Y and 3 - - - - - - - - - - - - See Mil-M-38510, appendix C Case outline X - - - - - - - - - - - - - - - 26°C/W 3/ Case outline Z - - - - - - - - - - - - - - - 20°C/W 3/ Junction temperature (T_j) - - - - - - - - - - - +175°C Storage temperature range - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Ground voltage (GND) - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - 2.2 V dc minimum Input low voltage (V_IL) - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - 4/ percent

intended Use: