DLA - SMD-5962-93140 REV A
MICROCIRCUIT, HYBRID, LINEAR, POWER MOSFET, SINGLE CHANNEL, OPTOCOUPLER
| Organization: | DLA |
| Publication Date: | 19 January 1994 |
| Status: | inactive |
| Page Count: | 16 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 HSSR-7111 Power switch with optically isolated control
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line Z See figure 1 8 Dual-in-line
The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Input current (IFON) . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Peak repetitive input current (IFPK) . . . . . . . . . . . . . . . . 40 mA 2/ Peak surge input current (IFPK surge) . . . . . . . . . . . . . . . . 100 mA 3/ Reverse input voltage (VR) . . . . . . . . . . . . . . . . . . . . . 5 V dc Output current: IO (AC or DC loads, connection A) . . . . . . . . . . . . . . . . . 0.8 A IO (DC load only, connection B) . . . . . . . . . . . . . . . . . . 1.6 A Single shot output current: IOPK surge (AC or DC loads, connection A, pulse width <10 ms) . . . 5.0 A IOPK surge (DC load only, connection B, pulse width <10 ms) . . . . 10.0 A Output voltage: VO (AC or DC loads, connection A) . . . . . . . . . . . . . . . . . −90 V to +90 V VO (DC load only, connection B) . . . . . . . . . . . . . . . . . . 0 V to +90 V Output power dissipation (PO) . . . . . . . . . . . . . . . . . . . 800 mW 4/ Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +150°C Case operating temperature (TC) . . . . . . . . . . . . . . . . . . . +145°C 5/ Thermal resistance junction-to-case (θJC) . . . . . . . . . . . . . 15°C/W Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . +260°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Input current range (IFON) . . . . . . . . . . . . . . . . . . . . . 5 mA to 20 mA Input voltage range (VFOFF) . . . . . . . . . . . . . . . . . . . . . 0 to 0.6 V Ambient operating temperature range (TA) . . . . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
