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JEDEC JEP 128

Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing

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Organization: JEDEC
Publication Date: 1 November 1996
Status: active
Page Count: 11
scope:

This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests that require wafer-probe card to make electrical contact to test structures. Widespread use of this guide will afford the efficient and cost-effective use of water-probe test stations because of the need for fewer probe cards and probe-card changes to accommodate the various test structures that may need to be tested. 

Document History

JEDEC JEP 128
November 1, 1996
Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing
This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally,...

References

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