DLA - SMD-5962-90902
MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER
| Organization: | DLA |
| Publication Date: | 8 July 1992 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device Classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Supply voltage 01 MSK332B-12 FET input, closed loop buffer amplifier ±12 V 02 MSK332B-15 FET input, closed loop buffer amplifier ±15 V
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534
The case outline(s) shall be as designation in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline X See figure 1 (14-lead, .810" × .503" × .240"), dual-in-line package
The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VCC): Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±18 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±VCC Peak output current (IOUT) - - - - - - - - - - - - - - - - - - - - - - - - - - 50 mA Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - - - +300°C Total hybrid power dissipation (PD) - - - - - - - - - - - - - - - - - - - - - - 620 mW Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - - - - - - - - 20°C/W Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - +150°C
Supply voltage (VCC): Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±12 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range (TA) - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History