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DLA - SMD-5962-90902

MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER

inactive
Organization: DLA
Publication Date: 8 July 1992
Status: inactive
Page Count: 12
scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device Classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Supply voltage 01 MSK332B-12 FET input, closed loop buffer amplifier ±12 V 02 MSK332B-15 FET input, closed loop buffer amplifier ±15 V

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534

The case outline(s) shall be as designation in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X See figure 1 (14-lead, .810" × .503" × .240"), dual-in-line package

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (VCC): Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±18 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±VCC Peak output current (IOUT) - - - - - - - - - - - - - - - - - - - - - - - - - - 50 mA Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - - - +300°C Total hybrid power dissipation (PD) - - - - - - - - - - - - - - - - - - - - - - 620 mW Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - - - - - - - - 20°C/W Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - +150°C

Supply voltage (VCC): Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±12 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range (TA) - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

June 21, 2018
MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or...
December 13, 2011
MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or...
April 29, 2002
MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER
A description is not available for this item.
SMD-5962-90902
July 8, 1992
MICROCIRCUIT, HYBRID, LINEAR, FET INPUT, CLOSED LOOP BUFFER AMPLIFIER
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with...
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