DLA - SMD-5962-92304
MICROCIRCUIT, DIGITAL, MIL-STD-1553, MUX BUS REMOTE TERMINAL, HYBRID
| Organization: | DLA |
| Publication Date: | 10 November 1992 |
| Status: | active |
| Page Count: | 35 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 See 6.7 MIL-STD-15538, mux bus remote terminal
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X See figure 1 69 Grid array Y See figure 1 69 Flat pack
The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specification when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . −0.3 V dc to +7 V dc Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Thermal rise, case-to-junction . . . . . . . . . . . . . 15°C/W Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Power dissipation (TC = +125°C) . . . . . . . . . . . . . 110 mW Junction temperature (TJ) . . . . . . . . . . . . . . . . +175°C
Supply voltage range (VCC) . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum logic high input voltage (VIH) . . . . . . . . . +2 V dc Maximum logic low input voltage (VIL) . . . . . . . . . . +0.8 V dc Case operating temperature range (TC) . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History