scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number 1/ Circuit function Input/output levels Chip enable Access time 01 32K × 8 CMOS/SOI SRAM CMOS Dual 25 ns 02 32K × 8 CMOS/SOI SRAM TTL Dual 25 ns 03 32K × 8 CMOS/SOI SRAM CMOS Dual 25 ns 04 32K × 8 CMOS/SOI SRAM TTL Dual 25 ns 05 32K × 8 CMOS/SOI SRAM CMOS Dual 20 ns 06 32K × 8 CMOS/SOI SRAM TTL Dual 20 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y See figure 1 28 Flat pack Z See figure 1 36 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ............................ −0.5 V dc to +6.5 V dc DC input voltage range (V_IN)........................... −0.5 V dc to V_CC + 0.3 V dc DC output voltage range V_OUT).......................... −0.5 V dc to V_CC + 0.3 V dc Storage temperature range ............................. −65°C to +150°C Lead temperature (soldering, 5 seconds) ............... +270°C Thermal resistance, junction-to-case (Θ_JC): Case X .............................................. See MIL-STD-1835 Cases Y and Z ....................................... 2.0°C/watt Output voltage applied to high Z state................. −0.3 V dc to V_CC + 0.3 V dc Maximum power dissipation (P_D) ........................ 2 watts Maximum junction temperature (T_J) ..................... +175°C

Supply voltage range (V_CC) ....................................... 4.5 V dc (min) to 5.5 V dc (max) Supply voltage (V_SS).............................................. 0.0 V dc High level input voltage range (V_IH): Device type 01, 03, 05 (CMOS levels)............................ 0.7 × V_CC to V_CC + 0.3 V dc Device type 02, 04, 06 (TTL levels)............................. 2.2 V dc to V_CC + 0.3 V dc Low level input voltage range (V_IL): Device type 01, 03, 05 (CMOS-levels)............................ −0.3 V dc to 0.3 × V_CC Device type 02, 04, 06 (TTL levels) ............................ −0.3 V dc to 0.8 V dc Case operating temperature range (T_C)............................. −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................ 100 percent

intended Use: