scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 4010E-4 10000 gate programmable array 4 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non- JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA8-P191 191 1/ Pin grid array package Y see figure 1 196 Quad flat package Z see figure 1 196 Quad flat package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range to ground potential (V _CC) ...... −0.5 V dc to +7.0 V dc DC input voltage range ............................ −0.5 V dc to V_CC +0.5 V dc Voltage applied to three-state output(V _IS) .......... −0.5 V dc to V_CC +0.5 V dc Maximum power ........................................ 2.0 W Thermal resistance, junction-to-case (θ _JC): Case outline X .................................... See MIL-STD-1835 Case outline Y and Z .............................. 20°C/W 3/ Junction temperature (T _J) ........................... +150°C 4/ Lead temperature (soldering, 10 seconds) ............ +260°C Storage temperature range .......................... −65°C to +150°C

Case operating temperature Range(T _C) ................ −55°C to +125°C Supply voltage relative to ground(V _CC) .............. +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) ................................. 0 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ...... XX percent 6/

intended Use: