scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Frequency 01 L10c11 4/8-bit variable length shift register 30 ns 02 L10c11 4/8-bit variable length shift register 25 ns 03 L10c11 4/8-bit variable length shift register 20 ns 04 L21c11 8-bit variable length shift register 30 ns 05 L21c11 8-bit variable length shift register 25 ns 06 L21c11 8-bit variable length shift register 20 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 24 dual-in-line package 3 CQCC1-N28 28 leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Storage Temperature ..................................................... −65°C to +125°C Supply voltage with respect to ground (V_CC) ............................. −0.5 V to +7.0 v Input signal with respect to ground ..................................... −3.0 V to +7.0 V Signal applied to high impedance output ................................. −3.0 V to +7.0 V Output current into low outputs ......................................... 25 mA Latchup current ......................................................... > 400 mA Thermal resistance Junction-to-case (Θ_JC) ................................ See MIL-STD-1835 Lead temperature (soldering, 10 seconds) ................................ +275°C Power dissipation (P_D) .................................................. 250 mW Maximum junction temperature ............................................ 175°C

Operating ambient temperature ........................................... −55°C to +125°C Supply voltage range .................................................... 4.5 V ≤ V_CC ≤ 5.5 V

Fault coverage measurements of manufacturing logic test (MIL-STD-883, test method 5012 .......................... XX percent 2/

intended Use: