Standard Practice for Measuring the Cure Behavior of Thermosetting Resins Using Dynamic Mechanical Procedures
|Publication Date:||1 January 1995|
|ICS Code (Thermosetting materials):||83.080.10|
1.1 This practice covers the use of dynamic-mechanical-o
1.2 This practice is intended to provide means for determining the cure behavior of supported and unsupported thermosetting resins over a range of temperatures by free vibration and resonant and nonresonant forced-vibration techniques, in accordance with Practice D 4065. Plots of modulus, cure behavior, tan delta, and damping index as a function of time/temperature are indicative of the thermal advancement or cure characteristics of a resin.
1.3 This practice is valid for a wide range of frequencies, typically from 0.01 to 100 Hz. However, it is strongly recommended that low-frequency test conditions, generally below 1.5 Hz, will generate more definitive cure-behavior information.
1.4 This practice is intended for resin/substrate composites that have an uncured effective elastic modulus in shear greater than 0.5 MPa.
1.5 Apparent discrepancies may arise in results obtained under differing experimental conditions. These apparent differences from results observed in another study can usually be reconciled, without changing the observed data, by reporting in full (as described in this practice) the conditions under which the data were obtained.
1.6 Due to possible instrumentation compliance, especially in the compressive mode, the data generated may indicate relative and not necessarily absolute property values.
1.7 Test data obtained by this practice is relevant and appropriate for use in engineering design.
1.8 The values stated in SI units are to be regarded as the standard.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific precautionary statements are given in Note 5.
NOTE 1--There is no similar or equivalent IS0 standard.