scope:

FOREWORD

The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group.

The objective of this document is to provide a checklist of causes and recommended corrective actions for various process problems encountered during the wave soldering of printed wiring board assemblies. These problems may or may not be yielding recults defined as rejectable by applicable specifications.

IPC members, and others who utilize this checklist, are invited to contribute additional idéas they may have regarding causes of problems, and recommended corrective actions.