scope:

This drawing describes the requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (see 6.4) 512×8-bit Schottky PROM 90 02 (see 6.4) 512×8-bit Schottky PROM 45

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline J D-3 (24-lead, 0.600″ row spacing), dual-in-line package K F-6 (24-lead, 0.640″ × 0.420″ × 0.090″, MAX), flat package U C-12 (32-terminal, 0.560″ × 0.458″ × 0.120″, MAX), rectangular leadless chip carrier package 3 C-4 (28-terminal, 0.460″ SQ. × 0.100″, MAX), square leadless chip carrier package

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to 7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −1.5 V dc to 5.5 V dc Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 1/- - - - - - - - - 1.02 W Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) 2/- - - (See MIL-M-38510, appendix C) Maximum junction temperature (T_J)- - - - - - - - - +175°C Output sink current - - - - - - - - - - - - - - - 100 mA

Supply voltage range (V_CC) - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Case operating temperature range (T_C)- - - - - - - −55°C to +125°C Minimum high level input voltage (V_IH) - - - - - - 2.0 V dc Maximum low level input voltage (V_IL)- - - - - - - 0.8 V dc

intended Use: