Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
|Publication Date:||1 July 1993|
This document is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies.
There are many IPC specifications and standards that deal with methods for evaluating product. IPC-A-600, "Acceptability of Printed Boards," details the acceptability issues that have been established by consensus from the IPC membership. IPC-TM-650 provides information on the test methods that may be used to evaluate the acceptability of requirements that are detailed in the many performance specifications that presently exist as industry documents or military documents. Examples of these are MIL-P-5511 O, "Military Specification For Rigid Boards," IPC-RB-276 "Qualification and Performance Specification for Rigid Printed Boards," and IPC-SM-840, "Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards."
The intent of this technical report, therefore, is to identify the rationale for existing techniques that establish quality assessment procedures, as well as to put forth ideas that may be used for evaluating the products of the 1990s. In many instances, methods, procedures, and coupons have been developed and we have lost the information on the intent of these types of tools used to establish acceptability levels. IPC-TR-551 provides the insight into why concepts were developed, where the state-of-the-art is in agreement on these concepts, and what is needed for future development. Since IPC-TR-551 is a technical report, it is intended to act as a focal point for performance specifications, test methods, and acceptability requirements, providing the reader with an executive summary on the material contained in the various specifications and standards used by the industry.