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DLA - SMD-5962-86821 REV B

MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 5 October 1987
Status: inactive
Page Count: 11
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.l of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC42 Decoder, BCD-to-decimal

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, ¼" × ⅞"), dual-in-line package F F-5 (16-lead, ¼" × ⅜"), flat package 2 C-2(20-terminal, .350" × .350"), square chip carrier package

Supply voltage range (VCC) - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to Vcc + 0.5 V dc DC output voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to Vcc + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - - ±25 mA DC VCC or GND current (per pin) - - - - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 2/ - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θJC): Case E, F, and 2 - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - - - +175°C

Supply voltage (VCC) - - - - - - - - - - - - - - - - - +2.0 V dc to +6.0 V dc Case operating temperature range (TC)- - - - - - - - - −55°C to +125°C Input rise or fall time: VCC = 2.0 V- - - - - - - - - - - - - - - - - - - - - 0 to 1,000 ns VCC = 4.5 V- - - - - - - - - - - - - - - - - - - - - 0 to 500 ns VCC = 6.0 V- - - - - - - - - - - - - - - - - - - - - 0 to 400 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

May 16, 2022
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
December 22, 2015
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
November 10, 2010
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
June 18, 2004
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-86821 REV B
October 5, 1987
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.l of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
March 24, 1987
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
A description is not available for this item.
October 1, 1986
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
A description is not available for this item.
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