scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT2240 Octal buffer/line driver with 25 ohm series resistor and inverting three-state outputs, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) −0.5 V dc to +7.0 V dc 4/ DC output voltage range(V_OUT) −0.5 V dc to +7.0 V dc 4/ DC output current (I_OL)(per output) +30 mA DC input clamp current (I_IK)(V_IN < 0.0 V) −18mA DC output clamp current (I_OK)(V_OUT < 0.0 V) −50 mA Storage temperature range (T_STG) −65°C to +150°C Lead temperature (soldering, 10 seconds) +300°C Thermal resistance, junction-to-case (θ_JC) See MIL-STD-1835 Junction temperature (T_J) +175°C Maximum package power dissipation (P_D) 500 mW

Supply voltage range (V_CC) +4.5 V dc to +5.5 V dc Input voltage range (V_IN) +0.0 V dc to V_CC Output voltage range(V_OUT) +0.0 V dc to V_CC Maximum low level input voltage (V_IL) 0.8 V Minimum high level input voltage (V_IH) 2.0 V Maximum high level output current (I_OH) −24 mA Maximum low level output current (I_OL) +12 mA Maximum input rise or fall rate (Δt/ΔV) 5 ns/V Case operating temperature range (T_C) −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) XX percent 5/

intended Use: