DLA - SMD-5962-90986
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 256K X 4 VIDEO RAM, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 9 November 1992 |
| Status: | inactive |
| Page Count: | 52 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device.
The device type(s) shall identify the circuit function as follows:
DRAM SAM Device type Generic number 1/ Circuit function access time access time 01 256K × 4, multiport video RAM 120 ns 35 ns 02 256K × 4, multiport video RAM 100 ns 30 ns
The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shell meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed herein.
Outline letter Descriptive designator Terminals Package style X See figure 1 28 Dual-in-line package Y See figure 1 28 "J" lead chip carrier Z See figure 1 28 Rectangular leadless chip carrier
The lead finish shell be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Voltage range on any pin except DQ and SDQ 3/ . . . . . −1 V dc to 7 V dc Voltage range on DQ and SDQ 3/ . . . . . . . . . . . . . −1 V dc to VCC Voltage range on VCC 3/ . . . . . . . . . . . . . . . . . 0 V dc to 7 V dc Short circuit output current (per output) . . . . . . . . 50 mA Power dissipation (PD) . . . . . . . . . . . . . . . . . 1 W Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (θJC): 4/ Case outlines X, Y, and Z . . . . . . . . . . . . . . . 10.0°C/W Junction temperature (TJ) 5/. . . . . . . . . . . . . . . +175°C
Supply voltage range (VCC) . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Supply voltage (VSS) . . . . . . . . . . . . . . . . . . 0.0 V dc High Level input voltage range (VIH) . . . . . . . . . . 2.9 V dc to VCC Low level input voltage range (VIL) 6/ . . . . . . . . . −1.0 V dc to 0.6 V dc System transition times, rise and fall (tt) . . . . . . . 3 ns to 50 ns Case operating temperature range (TC) . . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 7/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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