BSI - BS CECC 23600-801
Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Multilayer Printed Boards with Through Connections
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| Organization: | BSI |
| Publication Date: | 15 June 1998 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
To be read in conjunction with BS EN 123000:1992,BS EN 123600:1997
Document History
BS CECC 23600-801
June 15, 1998
Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Multilayer Printed Boards with Through Connections
To be read in conjunction with BS EN 123000:1992,BS EN 123600:1997
References
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