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NPFC - MIL-STD-1276

LEADS FOR ELECTRONIC COMPONENT PARTS

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Organization: NPFC
Publication Date: 14 August 1963
Status: inactive
Page Count: 10

Document History

MIL-STD-1276K
March 24, 2023
LEADS FOR ELECTRONIC COMPONENT PARTS
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
February 12, 2018
LEADS FOR ELECTRONIC COMPONENT PARTS
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
January 2, 2013
LEADS FOR ELECTRONIC COMPONENT PARTS
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
March 30, 2010
Leads for Electronic Component Parts
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
March 14, 2005
LEADS FOR ELECTRONIC COMPONENT PARTS
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
January 14, 2000
LEADS FOR ELECTRONIC COMPONENT PARTS
Documents conforming to the requirements of this standard are intended for use of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition...
MIL-STD-1276
May 18, 1993
LEADS FOR ELECTRONIC COMPONENT PARTS
This standard establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith, and the...
MIL-STD-1276
January 28, 1987
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276C NOTICE 2
January 18, 1982
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276
September 2, 1980
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276C
June 13, 1979
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276
March 6, 1968
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276
May 14, 1965
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
MIL-STD-1276
August 14, 1963
LEADS FOR ELECTRONIC COMPONENT PARTS
A description is not available for this item.
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References

This document references:
ASTM B122/B122M - Standard Specification for Copper-Nickel-Tin Alloy, Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and Rolled Bar
Published by ASTM on October 1, 2020
This specification establishes the requirements for copper-nickel-tin alloy, copper-nickel-zinc alloy (nickel silver), and copper-nickel alloy plate, sheet, strip, and rolled bar. The following...
This document references:
ASTM B170 - Standard Specification for Oxygen-Free Electrolytic Copper—Refinery Shapes
Published by ASTM on April 10, 1999
This specification establishes the requirements for two grades of oxygen-free electrolytic copper wire bars, billets, and cakes produced without the use of metallic or metaloidal deoxidizers....
This document references:
ASTM B322 - Standard Guide for Cleaning Metals Prior to Electroplating
Published by ASTM on November 10, 1999
This guide describes the procedure for cleaning metal surfaces to obtain good adhesion of electrodeposited metals. The degree of cleanliness required for metals to be electroplated is greater than...
This document references:
ASTM B343 - Standard Practice for Preparation of Nickel for Electroplating with Nickel
Published by ASTM on July 15, 1992
This practice summarizes well-known, generally practical methods for producing adherent electrodeposits of nickel on nickel. Electrodeposits of nickel on nickel are produced, for example, to improve...
This document references:
B452 - Standard Specification for Copper-Clad Steel Wire for Electronic Application
May 1, 2022
This specification covers bare round copper-clad steel wire for electronic application. Four classes of copper-clad steel wire are covered as follows: Class 30HS—Nominal 30 % conductivity...
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