ASTM International - ASTM F775-88
Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
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| Organization: | ASTM International |
| Publication Date: | 1 January 1988 |
| Status: | inactive |
| Page Count: | 7 |
| ICS Code (Semiconducting materials): | 29.045 |
Document History
ASTM F775-88
January 1, 1988
Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
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