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ASTM International - ASTM F775-88

Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)

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Organization: ASTM International
Publication Date: 1 January 1988
Status: inactive
Page Count: 7
ICS Code (Semiconducting materials): 29.045

Document History

ASTM F775-88
January 1, 1988
Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
A description is not available for this item.
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