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ASTM International - ASTM F1238-95(2003)

Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

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Organization: ASTM International
Publication Date: 10 December 1999
Status: inactive
Page Count: 2
ICS Code (Electronic tubes): 31.100
scope:

1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.

1.2 The values stated in SI units are regarded as standard.

abstract:

This specification covers refractory silicide sputtering targets for use in microelectronic applications. Targets shall be classified by the following major constituents: molybdenum silicide,... View More

Document History

June 1, 2011
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)
This specification covers refractory silicide sputtering targets for use in microelectronic applications. Targets shall be classified by the following major constituents: molybdenum silicide,...
ASTM F1238-95(2003)
December 10, 1999
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
This specification covers refractory silicide sputtering targets for use in microelectronic applications. Targets shall be classified by the following major constituents: molybdenum silicide,...
December 10, 1999
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to...
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