ASTM International - ASTM D176-07
Standard Test Methods for Solid Filling and Treating Compounds Used for Electrical Insulation
|Publication Date:||1 May 2007|
|ICS Code (Insulating materials in general):||29.035.01|
significance And Use:
The melting point is useful in selecting a filling or treating compound that will not flow at the operating temperature of the device in which it will be used. It is also essential that it shall... View More
The melting point is useful in selecting a filling or treating compound that will not flow at the operating temperature of the device in which it will be used. It is also essential that it shall not be so high as to injure the insulation at the time of pouring. This test method is suitable for specification, classification, and for control of product uniformity.View Less
1.1 These test methods cover physical and electrical tests for solid filling and treating compounds used for electrical insulation which are fusible to a liquid without significant chemical reaction. Compounds that are converted to the solid state by polymerization, condensation, or other chemical reaction are not included in these test methods.
1.2 These test methods are designed primarily for asphaltic or bituminous compounds, waxes, and fusible resins, or mixtures thereof, although some of these methods are applicable to semisolid types such as petrolatums. Special methods more suitable for hydrocarbon waxes are contained in Test Methods D 1168.
1.3 Provide adequate ventilation when these tests involve heating.
1.4 The test methods appear in the following sections:
p>1.5 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see and .
There is no similar or equivalent IEC or ISO standard.