Creep data that are obtained over a relatively short period of time in this test method can provide a measure of an adhesive bond's ability to withstand static loading in shear over a relatively long period of time. Creep measurements are made over a range of expected service conditions, including level of stress, temperature, relative humidity, and duration of load. Creep rate, creep strain, and creep modulus are calculated at the various service conditions.

Creep data can be used to (1) predict performance of an adhesive under long-term loading, (2) characterize an adhesive, (3) compare adhesives with each other and against specifications, and (4) design structural members fabricated with an adhesive.

Time-to-failure data provide a measure of the ultimate load-carrying ability of an adhesive bond as a function of time at various levels of stress, temperature, and relative humidity.

With proper caution, time-to-failure data derived from relatively short loading periods can be extrapolated to estimate the useful service life of an adhesive at working levels of static stress. This property may also be used with creep data to accomplish purposes listed in 4.2.

This test method is a research tool intended for development or evaluation of new adhesives and new product designs. The researcher may select from suggested tests those that are appropriate. However, creep and time-to-failure tests are nonroutine and can be time-consuming and expensive, so tests must be selected with care.

The apparatus and procedures may be suitable for measuring creep properties of adhesives on substrates other than wood, such as metal, plastic, and glass, but such considerations are not within the scope of this test method.