ASTM International - ASTM F487-88(2001)
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
inactive
Buy Now
| Organization: | ASTM International |
| Publication Date: | 1 January 2001 |
| Status: | inactive |
| Page Count: | 3 |
| ICS Code (Wires): | 29.060.10 |
scope:
1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
Document History
March 1, 2018
Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters...
January 1, 2013
Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters...
January 1, 2006
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall...
January 1, 2001
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For...
ASTM F487-88(2001)
January 1, 2001
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For...
Related Products
Searching for related products...