UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ASTM International - ASTM F677-95(1999)

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

inactive
Buy Now
Organization: ASTM International
Publication Date: 10 November 1999
Status: inactive
Page Count: 4
ICS Code (Electronic components in general): 31.020
scope:

1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.

Note 1-To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms "weight" and "weigh" are used in this test method although the units of measurement are those of mass.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 8.1.

1.3 The values stated in SI units are standard. The values in parentheses are for information only.

Document History

April 1, 2013
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature....
October 1, 2009
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature....
March 1, 2004
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 0) and volume under defined conditions of time and temperature....
ASTM F677-95(1999)
November 10, 1999
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature....
Advertisement