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ASTM International - ASTM F3147-15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

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Organization: ASTM International
Publication Date: 1 June 2015
Status: active
Page Count: 3
ICS Code (Electronic components in general): 31.020
significance And Use:

4.1 The existing Test Method F1995, while very useful, is difficult to conduct if an encapsulating dome is applied, and does not reveal the possible failures caused by mechanical stress... View More

scope:

1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

Document History

ASTM F3147-15
June 1, 2015
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
4.1 The existing Test Method F1995, while very useful, is difficult to conduct if an encapsulating dome is applied, and does not reveal the possible failures caused by mechanical stress...
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