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IPC - TM-650 2.3.9D

Flammability of Prepreg and Thin Laminate

active, Most Current
Organization: IPC
Publication Date: 1 August 1997
Status: active
Page Count: 2
scope:

This test method is designed to determine the degree of flame resistance of laminates less than 0.5 mm [0.020 in] in thickness, and prepreg.

Document History

TM-650 2.3.9D
August 1, 1997
Flammability of Prepreg and Thin Laminate
This test method is designed to determine the degree of flame resistance of laminates less than 0.5 mm [0.020 in] in thickness, and prepreg.
TM-650 2.3.9C
December 1, 1994
Flammability of Prepreg and Thin Laminate
A description is not available for this item.

References

This document references:
TM-650 2.3.6A - Etching Ammonium Persulfate Method
Published by IPC on July 1, 1975
To determine the quality of the dielectric material after etching with ammonium persulfate.
This document references:
TM-650 2.3.7.1A - Cupric Chloride Etching Method
Published by IPC on December 1, 1994
This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using cupric chloride as the etching solution for removal of copper...
This document references:
TM-650 2.3.7.2A - Alkaline Etching Method
Published by IPC on December 1, 1994
This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using an alkaline etching solution for removal of copper cladding.
This document references:
TM-650 2.3.7A - Etching Ferric Chloride Method
Published by IPC on July 1, 1975
To determine the quality of the dielectric material after etching with ferric chloride.
This document is referenced by:
IPC-4821 - Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Published by IPC on April 1, 2010
A description is not available for this item.
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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