UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ASTM International - ASTM F3192-16

Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization

active
Buy Now
Organization: ASTM International
Publication Date: 1 September 2016
Status: active
Page Count: 5
ICS Code (Metallic coatings): 25.220.40
scope:

1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

1.2 Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.

1.2.1 Purity Requirements: 

1.2.1.1 Metallic element impurities, and

1.2.1.2 Non-metallic element impurities.

1.2.2 Grain Size Requirements-Grain size.

1.2.3 Inner Quality Requirements-Internal defect.

1.2.4 Bonding Requirements: 

1.2.4.1 Backing plate, and

1.2.4.2 Bonding ratio.

1.2.5 Configuration Requirements: 

1.2.5.1 Dimension,

1.2.5.2 Tolerance, and

1.2.5.3 Surface roughness.

1.2.6 Appearance Requirements-Surface cleanness.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

abstract:

This specification establishes the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced... View More

Document History

ASTM F3192-16
September 1, 2016
Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging....
Advertisement