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IPC-2221

Generic Standard on Printed Board Design

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Organization: IPC
Publication Date: 1 February 1998
Status: inactive
Page Count: 130
scope:

This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.

Purpose. The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and attach passive and active components.

The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to perform the physical, thermal,

Document History

June 1, 2018
Generic Standard on Printed Board Design
A description is not available for this item.
November 1, 2012
Generic Standard on Printed Board Design
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The...
May 1, 2003
Generic Standard on Printed Board Design
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...
IPC-2221
February 1, 1998
Generic Standard on Printed Board Design
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...

References

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