DLA - SMD-5962-89947
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 12-STAGE RIPPLE-CARRY BINARY COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 17 July 1991 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This drawing forms a part of a one part - one pert number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54HCT4040 12-stage ripple-carry binary counters, TTL compatible inputs
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.
Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC output voltage - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - - - - ±25 mA DC VCC or GND current (per pin) - - - - - - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - - - - 500 mW 2/ Lead temperature (soldering, 10 seconds) - - - - - - - - - +300°C Thermal resistance, junction-to-base (ΘJC) - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - - - - +175°C
Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage (VOUT) - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature (TC) - - - - - - - - - - - - - - −55°C to +125°C Input rise and fall time (tr, tf): VCC = 4.5 V, 5.5 V - - - - - - - - - - - - - - - - - - - 0 to 500 ns Minimum clock (φ) pulse width (tw1): TC = +25°C, VCC = 4 5 V - - - - - - - - - - - - - - - - - 20 ns TC = −55°C +125°C, VCC = 4.5 V - - - - - - - - - - - - - 30 ns Minimum reset pulse width (tw2): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - - - - 20 ns TC = −55°C +125°C, VCC = 4.5 V - - - - - - - - - - - - - 30 ns Minimum MR removal time (tREM): TC = +25°C, VCC = 4 5 V - - - - - - - - - - - - - - - - - 10 ns TC = −55°C +125°C VCC = 4.5 V - - - - - - - - - - - - - 15 ns Maximum input pulse frequency (fMAX): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - - - - 25 MHz TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - - - - 16 MHz
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - XX percent 4/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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