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IPC-CF-152

Composite Metallic Material Specification for Printed Wiring Board

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Organization: IPC
Publication Date: 1 December 1997
Status: active
Page Count: 33
scope:

This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.

Purpose

This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.

Document History

IPC-CF-152
December 1, 1997
Composite Metallic Material Specification for Printed Wiring Board
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of...
CF-152A
January 1, 1994
Composite Metallic Material Specification for Printed Wiring Boards
A description is not available for this item.

References

This document references:
ASTM E345 - Standard Test Methods of Tension Testing of Metallic Foil
Published by ASTM on July 15, 2016
These test methods cover the tension testing of metallic foil at room temperature. Exception to these methods may be necessary in individual specifications or test methods for a particular material....
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
ASTM E384 - Standard Test Method for Microindentation Hardness of Materials
Published by ASTM on June 1, 2017
This test method covers determination of the microindentation hardness of materials This test method covers microindentation tests made with Knoop and Vickers indenters under test forces in the range...
This document references:
ASTM E8/E8M - Standard Test Methods for Tension Testing of Metallic Materials
Published by ASTM on February 1, 2021
These test methods cover the tension testing of metallic materials in any form at room temperature, specifically, the methods of determination of yield strength, yield point elongation, tensile...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document is referenced by:
IPC-4811 - Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Published by IPC on April 1, 2008
This document describes materials that can be used for the fabrication of embedded resistor devices within the finished printed circuit board substrate. It provides information on general...
This document is referenced by:
IPC-DW-424 - General Specification for Encapsulated Discrete Wire Interconnection Board
Published by IPC on January 1, 1995
This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires which terminate in plated holes.
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
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