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IPC-CF-152

Composite Metallic Material Specification for Printed Wiring Board

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Organization: IPC
Publication Date: 1 December 1997
Status: active
Page Count: 33
scope:

This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.

Purpose

This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.

Document History

IPC-CF-152
December 1, 1997
Composite Metallic Material Specification for Printed Wiring Board
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of...
January 1, 1994
Composite Metallic Material Specification for Printed Wiring Boards
A description is not available for this item.

References

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