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IPC-CF-152

Composite Metallic Material Specification for Printed Wiring Board

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Organization: IPC
Publication Date: 1 December 1997
Status: active
Page Count: 33
scope:

This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.

Purpose

This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.

Document History

IPC-CF-152
December 1, 1997
Composite Metallic Material Specification for Printed Wiring Board
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of...
CF-152A
January 1, 1994
Composite Metallic Material Specification for Printed Wiring Boards
A description is not available for this item.

References

This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
TM-650 2.3.7A - Etching Ferric Chloride Method
Published by IPC on July 1, 1975
To determine the quality of the dielectric material after etching with ferric chloride.
This document references:
TM-650 2.3.7.1A - Cupric Chloride Etching Method
Published by IPC on December 1, 1994
This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using cupric chloride as the etching solution for removal of copper...
This document references:
TM-650 2.3.6A - Etching Ammonium Persulfate Method
Published by IPC on July 1, 1975
To determine the quality of the dielectric material after etching with ammonium persulfate.
This document references:
TM-650 2.3.1.1B - Chemical Cleaning of Metal Clad Laminate
Published by IPC on May 1, 1986
This method evaluates the chemical cleanability of metal clad laminates surfaces of oxidation and anti-oxidation protective coatings.
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document is referenced by:
IPC-2226 - Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Published by IPC on September 1, 2017
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and...
This document is referenced by:
IPC-6012 ITALIAN - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2004
Dichiarazione degli obiettivi Questa specifica riguarda la qualificazione ed i requisiti dei circuiti stampati rigidi. I circuiti stampati possono essere monofaccia, doppiafaccia con o senza fori...
This document is referenced by:
IPC-4101 CHINESE - Specification for Base Materials for Rigid and Multilayer Printed Boards
Published by IPC on March 1, 2017
A description is not available for this item.
This document is referenced by:
IPC-2222 GERMAN - Sectional Design Standard for Rigid Organic Printed Boards
Published by IPC on December 1, 2010
A description is not available for this item.
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