Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
|Publication Date:||14 May 2001|
|ICS Code (Semiconductor devices in general):||31.080.01|
The European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged seminconductor die. This specification also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die. ES 59008-5-1 specifies particular requirements and recommendations for bare die and wafers that are not contained elsewhere in this series of specifications This specification is for use by semiconductor manufacturers, suppliers, die processors and users of semiconductor die. ES 59008-5-1 is to be read in conjunction with ES 59008-1, General requirements, and ES 59008-3, Mechanical, material and connectivity requirements, and where relevant, ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.