scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 See 6.6 16K × 4 static ram 25 ns (data retention) 02 " " 25 ns 03 " " 20 ns (data retention) 04 " " 20 ns 05 " " 15 ns (data retention) 06 " " 15 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090"), flat package X Figure 1 (22-lead, 1.260 × .310" × .150"), dual-in-line package Y Figure 1 (22-lead, 1.110" × .310" × .175"), dual-in-line package Z Figure 1 (22-terminal, .490" × .290" × .080"), leadless chip carrier package

Supply voltage range (V_CC) - - - - - - - - - - - −0.5 V dc to +7.0 V dc 1/ DC output current - - - - - - - - - - - - - - - - 20 mA Ambient storage temperature - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - −55°C to +125°C Thermal resistance, junction-to-case (θ_JC): Case K - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Cases X and Y - - - - - - - - - - - - - - - - - 28°C/W 2/ Case Z - - - - - - - - - - - - - - - - - - - - 22°C/W 2/ Power dissipation (P_D)- - - - - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - +260°C

Supply voltage (V_CC) - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc 3/ Ground voltage (V_SS) - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - +2.2 V dc to V_CC +0.5 V dc Input low voltage (V_IL) - - - - - - - - - - - - - −0.5 V dc to .8 V dc 4/ Operating case temperature range (T_C) - - - - - - −55°C to +125°C

intended Use: