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DLA - SMD-5962-86820 REV B

MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 11 October 1990
Status: inactive
Page Count: 12
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC4050 Converter, hex logic level down

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to +16 V dc DC output voltage - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - ±25 mA DC VCC or GND current (per pin) - - - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 2/ - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θJC) - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - - - - - 175°C

Supply voltage (VCC) - - - - - - - - - - - - - - - - - +2.0 V dc to +6.0 V dc Input voltage range (VIN)- - - - - - - - - - - - - - - 0.0 V to +15 V dc Output voltage range (VOUT)- - - - - - - - - - - - - - 0.0 V to VCC Case operating temperature range (TC)- - - - - - - - - −55°C to +125°C Input rise or fall time: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 0 to 1000 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 0 to 500 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 0 to 400 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

September 24, 2020
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead...
August 27, 2013
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
December 17, 2007
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
January 25, 2002
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
June 22, 2000
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by...
November 5, 1999
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by...
SMD-5962-86820 REV B
October 11, 1990
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
July 29, 1987
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
September 19, 1986
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX BUFFER/CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
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