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DLA - DESC-DWG-88023 REV A

DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED

inactive
Organization: DLA
Publication Date: 16 December 1988
Status: inactive
Page Count: 9

Document History

DESC-DWG-88023
July 1, 2010
DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM...
DESC-DWG-88023 REV C
March 16, 1992
DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM...
DESC-DWG-88023 REV B
December 13, 1990
DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
A description is not available for this item.
DESC-DWG-88023 REV A
December 16, 1988
DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
A description is not available for this item.
DESC-DWG-88023
January 14, 1988
DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
A description is not available for this item.

References

This document references:
MIL-DTL-19491 - SEMICONDUCTOR DEVICES, PACKAGING OF
Published by NPFC on March 17, 2021
Scope. This specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes (FSC 5961) (see 6.1).
This document references:
MIL-D-83532 - DELAY LINES, ACTIVE, GENERAL SPECIFICATION FOR
Published by NPFC on February 5, 1993
A description is not available for this item.
This document references:
MIL-STD-202 - TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS
Published by NPFC on February 6, 1956
A description is not available for this item.
This document references:
MIL-T-10727 - TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS
Published by NPFC on February 7, 1997
A description is not available for this item.
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