ECIA - EIA-887
Thin Film Resistor Network Specification
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| Organization: | ECIA |
| Publication Date: | 1 April 2001 |
| Status: | inactive |
| Page Count: | 18 |
scope:
This specification was prepared by the P-1 Committee on Resistive Components of the Electronic Industries Alliance's sector Electronic Components, Assemblies, Equipment & Supplies Association (EIA/ECA).
Document History
October 1, 2023
Resistors, Thin Film Array on Silicon - Molded
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
January 1, 2007
Thin Film Resistor Network Specification
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
January 1, 2007
Thin Film Resistor Network Specification
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
EIA-887
April 1, 2001
Thin Film Resistor Network Specification
This specification was prepared by the P-1 Committee on Resistive Components of the Electronic Industries Alliance’s sector Electronic Components, Assemblies, Equipment & Supplies Association...