scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 SPT7710A 8-Bit 150 MSPS Flash A/D Converter 02 SPT7710B 8-Bit 150 MSPS Flash A/D Converter 03 SPT7725A 8-Bit 300 MSPS Flash A/D Converter 04 SPT7725B 8-Bit 300 MSPS Flash A/D Converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-SID-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 44 Ceramic gullwing-lead chip carrier Y See figure 1 42 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Negative supply voltage (V_EE to GND) - - - - - - - - - - - - - - - - - - - - −7.0 V dc to +0.5 V dc Ground voltage differential - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +0.5 V dc Analog input voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - - V_EE to +0.5 V dc Reference input voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - V_EE to +0.5 V dc Digital input voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - - V_EE to +0.5 V dc Reference current (V_RTF to V_RBF) - - - - - - - - - - - - - - - - - - - - - - 25 mA Digital output current - - - - - - - - - - - - - - - - - - - - - - - - - - - 0 to −30 mA Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - - - - +150°C

Case operating temperature range - - - - - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: