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IEC/PAS 62174

Resistance to Soldering Temperature for Through-Hole Mounted Devices

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Organization: IEC
Publication Date: 1 August 2000
Status: inactive
Page Count: 12

Document History

IEC/PAS 62174
August 1, 2000
Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.

References

This document is superseded by:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on July 1, 2020
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
This document is superseded by:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on July 1, 2020
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
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