UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close

This is embarrasing..

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close

Select Your Free Newsletters

Industry Newsletters

Privacy Policy

This is embarrasing..

An error occurred while processing the form. Please try again in a few minutes.

Standards Library
  • All
  • News & Analysis
  • Products & Services
  • Standards Library
  • Reference Library
  • Community

I forgot my password.

Don't have an account?

Register here.

IEC/PAS 62174

Resistance to Soldering Temperature for Through-Hole Mounted Devices

inactive
Buy Now
Organization: IEC
Publication Date: 1 August 2000
Status: inactive
Page Count: 12

Document History

IEC/PAS 62174
August 1, 2000
Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.

References

This document is superseded by:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on October 1, 2010
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
This document is superseded by:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on October 1, 2010
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
Advertisement