IEC 60249-2-13
Base Materials for Printed Circuits Part 2: Specifications Specification No. 13: Flexible Copper-Clad Polyimide Film, General Purpose Grade
inactive
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| Organization: | IEC |
| Publication Date: | 1 January 1987 |
| Status: | inactive |
| Page Count: | 34 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
IEC 60249-2-13
January 1, 1987
Base Materials for Printed Circuits Part 2: Specifications Specification No. 13: Flexible Copper-Clad Polyimide Film, General Purpose Grade
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