scope:

This drawing forms a part of a one part - one part number documentation system (see 6.5 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Nanoseconds 01 LSH32 32-bit cascadable barrel shifter 50 ns 02 LSH32 32-bit cascadable barrel shifter 40 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X C-7 (68-terminal, .962" × .962" × .120") square leadless chip carrier package Y P-AC (68-pin SQ. 1.180" × 1.180" × .345") square pin grid array package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature - - - - - - - - - - - - - - - - - - - −65°C to +150°C V_CC supply voltage with respect to ground - - - - - - - - −0.5 V to +7.0 V Input signal with respect to ground - - - - - - - - - - - −0.5 V to V_CC + 0.5 Signal applied to high impedance output - - - - - - - - - −0.5 V to V_CC + 0.5 Output current into low outputs - - - - - - - - - - - - - 25 mA Maximum power dissipation - - - - - - - - - - - - - - - - 165 mW Thermal resistance, junction to case (θ_JC) - - - - - - - See MIL-M-38510, appendix C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - 4.50 V ≤ V_CC ≤ 5.50 V Ambient operating temperature range (T_A) - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - XX percent 2/

intended Use: