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ASTM F1530

Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning

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Organization: ASTM
Publication Date: 10 December 2002
Status: inactive
Page Count: 12
ICS Code (Semiconducting materials): 29.045
scope:

This test method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is required.

This test method is applicable to wafers 50 mm or larger in diameter, and 100 ┬Ám (0.004 in.) approximately and larger in thickness, independent of thickness variation and surface finish, and of wafer shape.

This test method measures the flatness of the front wafer surface as it would appear relative to a specified reference plane when the back surface of the water is ideally flat, as when pulled down onto an ideally clean, flat chuck. It does not measure the free-form shape of the wafer.

Because no chuck is used as a measurement reference, this test method is relatively insensitive to microscopic particles on the back surface of the wafer.

The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Document History

ASTM F1530
December 10, 2002
Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
This test method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is required....
January 1, 1994
Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
1. Scope 1.1 This test method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is...
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