DLA - SMD-5962-91534
MICROCIRCUIT, LINEAR, LOW POWER, 70 MHZ BUFFER AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 23 May 1991 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 EL2001A Low power, 70 MHz buffer amplifier 02 EL2001 Low power, 70 MHz buffer amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non -JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and listed below.
Outline letter Case outline P D-4 (8-lead, .405" × .310" × .200"), dual-in-line package 2 C-2 (20 terminal, .358" × .358" × .100"), square chip carrier package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VS) - - - - - - - - - - - - - - - - ±18 V dc or 36 V dc
Input voltage (VIN) 1/- - - - - - - - - - - - - - - ±15 V dc
Input voltage (IIN) 1/- - - - - - - - - - - - - - - ±50 mA
Output short circuit duration 2/- - - - - - - - - - 50 mA max
Junction temperature (TJ) - - - - - - - - - - - - - 175°C
Storage temperature range - - - - - - - - - - - - - −65°C to 150°C
Lead temperature (soldering, 10 seconds)- - - - - - 300°C
Thermal resistance, junction-to-case (ΘJC)3/- - - - See MIL-M-38510,appendix
Supply voltage (VS) - - - - - - - - - - - - - - - - ±15 V dc Series resistance (RS)- - - - - - - - - - - - - - - 50Ω Load resistance (RL)- - - - - - - - - - - - - - - - 100Ω Ambient operating temperature range (TA)- - - - - - −55°C to 125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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