scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally-packaged die. Part 1 specifies: product identity, product data, die mechanical information, test, quality and reliability information, handling, storage and mounting information, thermal data and electrical simulation data.