scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 68442-8 Extended dual channel direct memory access controller

The case outline(s) shall be as designated in appendix C of MIL-M-38510 and as follows:

Outline Letter Case outline X 68-pin (1.07" × 1.07" × 0.102"), pin grid array (see figure 1) Y 68-pin (0.96" × 0.96" × 0.125"), ceramic chip, leaded chip carrier package (see figure 2)

Supply voltage range with respect to GND (V_CC) - - - - - −0.3 V dc to +7.0 V dc Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation - - - - - - - - - - - - - - - 1.75 W Maximum operating temperature (T_C) - - - - - - - - - - - −55°C to +110°C Lead temperature (soldering, 5 seconds) - - - - - - - - +270°C Junction temperature (T_J) - - - - - - - - - - - - - - - +150°C Thermal resistance, junction-to-case (θ_JC): Cases X and Y - - - - - - - - - - - - - - - - - - - - 10°C/W Input capacitance (C_IN) - - - - - - - - - - - - - - - - 13 pF

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - - - 2.0 V dc to V_CC Low level input voltage (V_IL) - - - - - - - - - - - - - GND −0.3 V to 0.8 V Minimum high level output voltage (V_OH) - - - - - - - - 2.4 V dc Maximum low level output voltage (V_OL) - - - - - - - - - 0.4 V dc Frequency of operation: Device type 01 - - - - - - - - - - - - - - - - - - - - 2.0 to 8.0 MHz Case operating temperature (T_C)- - - - - - - - - - - - - −55°C to +110°C

intended Use: