DS/IEC 68-2-58
Environmental testing - Part 2: Tests - Test Td: Soldering heat of Surface Mounting Devices (SMD)
inactive, Most Current
| Organization: | DS |
| Publication Date: | 11 September 1990 |
| Status: | inactive |
| ICS Code (Environmental testing): | 19.040 |
scope:
The standard provides a standard procedure for determining t he solderability, resistance to dissolution of metallization and resistance to soldering heat devices (SMD) (hereafter r eferred to as specimens). The procedure uses a solder bath a nd is applicable only to specimens of products designed to w ithstand short-term immersion in molten solder.
Document History
DS/IEC 68-2-58
September 11, 1990
Environmental testing - Part 2: Tests - Test Td: Soldering heat of Surface Mounting Devices (SMD)
The standard provides a standard procedure for determining t he solderability, resistance to dissolution of metallization and resistance to soldering heat devices (SMD) (hereafter r eferred to as...
References
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