scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 68881-12 HCMOS floating point coprocessor 02 68881-15 HCMOS floating point coprocessor 03 68881-20 HCMOS floating point coprocessor

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X P-AB (68-pin 1.080" × 1.080" × .345"), pin grid array package Y See figure 1 (68-lead, .960" × .960" × .135"), leaded chip carrier package

Supply voltage range with respect to GND (V_CC) - - - −0.3 V dc to +7.0 V dc Storage temperature range - - - - - - - - - - - - - −55°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 W Lead temperature (soldering. 5 seconds) - - - - - - +270°C Junction temperature (T_J) - - - - - - - - - - - - - +150°C Thermal resistance, Junction-to-case (θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510. appendix C Case Y - - - - - - - - - - - - - - - - - - - - - - 10°C/W

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum High level input voltage range (V_IH): All inputs - - - - - - - - - - - - - - - - - - - - 2.0 V dc to 5.25 V dc Low level input voltage range (V_IL): All inputs - - - - - - - - - - - - - - - - - - - - GND −0.3 V dc to 0.8 V dc Minimum high level output voltage- - - - - - - - - - 2.4 V dc Maximum low level output voltage - - - - - - - - - - 0.5 V dc Case operating temperature range (T_C)- - - - - - - - −55°C to +125°C

intended Use: