IPC - TM-650 2.4.12
Solderability, Edge Dip Method
inactive
| Organization: | IPC |
| Publication Date: | 1 April 1973 |
| Status: | inactive |
| Page Count: | 3 |
Document History
June 1, 1991
Solderability, Edge Dip Method
This method is used to determine the solderability of copper foil, copper clad laminate, and printed boards. This method does not specifically relate to the solderability of the internal plating in...
TM-650 2.4.12
April 1, 1973
Solderability, Edge Dip Method
A description is not available for this item.