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ASTM - B598

STANDARD RECOMMENDED PRACTICE FOR DETERMINING OFFSET YIELD STRENGTH FOR COPPER ALLOYS (R 1980)

inactive
Organization: ASTM
Publication Date: 19 September 1974
Status: inactive
Page Count: 2
ICS Code (Copper and copper alloys): 77.120.30

Document History

September 1, 2014
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
This practice establishes the requirements for determining offset yield strength (0.01 %, 0.02 %, and 0.05 % offset) at room temperature. It is intended for copper alloys in tempers commonly used for...
April 1, 2014
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
This practice establishes the requirements for determining offset yield strength (0.01 %, 0.02 %, and 0.05 % offset) at room temperature. It is intended for copper alloys in tempers commonly used for...
April 1, 2009
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
This practice establishes the requirements for determining offset yield strength (0.01 %, 0.02 %, and 0.05 % offset) at room temperature. It is intended for copper alloys in tempers commonly used for...
October 10, 1998
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
(Footnote *) This practice establishes the requirements for determining offset yield strength (0.01 %, 0.02 %, and 0.05 % offset) at room temperature. It is intended for copper alloys in tempers...
October 10, 1998
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
1. Scope* 1.1 This practice establishes the requirements for determining offset yield strength (0.01 %, 0.02 %, and 0.05 % offset) at room temperature. It is intended for copper alloys in tempers...
June 27, 1986
Standard Practice for Determining Offset Yield Strength in Tension for Copper Alloys
A description is not available for this item.
B598
September 19, 1974
STANDARD RECOMMENDED PRACTICE FOR DETERMINING OFFSET YIELD STRENGTH FOR COPPER ALLOYS (R 1980)
A description is not available for this item.

References

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