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DLA - SMD-5962-93178

MICROCIRCUIT, LINEAR, 64 GREY SHADE, 128 OUTPUT, COLUMN DRIVER, MONOLITHIC SILICON, TAPE AUTOMATED BOND TECHNOLOGY

inactive
Organization: DLA
Publication Date: 18 March 1994
Status: inactive
Page Count: 21
scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and Appendix F of MIL-I-38535, "General provisions for TAB microcircuits". When available, a choice of Radiation Hardness Assurance (RNA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MRG064-128 64 Grey shade, 128 output column driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 and Appendix F of MIL-I-38535. Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated herein:

Outline letter Descriptive designator Terminals Package style Z See figure 1 190 Environmentally protected tape automated bond

The lead finish shall be as specified in Appendix F of MIL-I-38535 for all device classes.

Supply voltage ranges: VCC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7.0 V dc VEE - - - - - - - - - - - - - - - - - - - - - - - - - - -.- - - - - - - - - VCC + 0.3 V dc to VCC − 18.0 V dc Input voltage for DIO1, DIO2, D(0..5), FSTCHG, CLK, DST, RESET, SHFTUP, MODE1, MODE2, JTAG bus (VIND) - - - - - - - - - - - - - - - - - - - −0.3 V dc to VCC + 0.3 V dc Output voltage for DIO1, DIO2, JTAG bus (VOUTD) - - - - - - - - - - - - - - −0.3 V dc to VCC + 0.3 V dc Input voltage range for VLX - - - - - - - - - - - - - - - - - - - - - - - - - VCC + 0.3 V dc to VEE − 0.3 V dc Output voltage range for 01 - 0128 (VOUTA) - - - - - - - - - - - - - - - - - VCC + 0.3 V dc to VEE − 0.3 V dc Input current, VCC (IID) - - - - - - - - - - - - - - - - - - - - - - - - - - ±10 mA Output current for 01 - 0128 (IOUTA) 2/ - -- - - - - - - - - - - - - - - - - ±l2 mA Output current for DIO1, DIO2 (IOUTD) - - - - - - - - - - - - - - - - - - - - ±5 mA Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −55°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - +300°C Power dissipation (PD) 3/ Chip-on-tape: Maximum clock frequency - - - - - - - - - - - - - - - - - - - - - - - - - 370 mW Thermal resistance, case-to-ambient (θCA) - - - - - - - - - - - - - - - - - - 17.3°C/W Maximum die temperature rise for the die at 100% - - - - - - - - - - - - - - 4.7°c Current reference input range (IREFIN) - - - - - - - - - - - - - - - - - - - 20 µA to 200 µA

Supply voltage range: VCC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc VEE - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −9.75 V dc to −12.25 V dc Logic input voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - 0 V dc to +5.0 V dc Maximum clock frequency - - - - - - - - - - - - - - - - - - - - - - - - - - 15 MHz Maximum test clock frequency - - - - - - - - - - - - - - - - - - - - - - - - 7 MHz Output voltage swing - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±6 V dc Ambient operating temperature range - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

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Document History

March 10, 2008
MICROCIRCUIT, LINEAR, 64 GREY SHADE, 128 OUTPUT, COLUMN DRIVER, MONOLITHIC SILICON, TAPE AUTOMATED BOND TECHNOLOGY
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
January 10, 1995
MICROCIRCUIT, LINEAR, 64 GREY SHADE, 128 OUTPUT, COLUMN DRIVER, MONOLITHIC SILICON, TAPE AUTOMATED BOND TECHNOLOGY
A description is not available for this item.
SMD-5962-93178
March 18, 1994
MICROCIRCUIT, LINEAR, 64 GREY SHADE, 128 OUTPUT, COLUMN DRIVER, MONOLITHIC SILICON, TAPE AUTOMATED BOND TECHNOLOGY
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...

References

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