DLA - SMD-5962-93178
MICROCIRCUIT, LINEAR, 64 GREY SHADE, 128 OUTPUT, COLUMN DRIVER, MONOLITHIC SILICON, TAPE AUTOMATED BOND TECHNOLOGY
| Organization: | DLA |
| Publication Date: | 18 March 1994 |
| Status: | inactive |
| Page Count: | 21 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and Appendix F of MIL-I-38535, "General provisions for TAB microcircuits". When available, a choice of Radiation Hardness Assurance (RNA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MRG064-128 64 Grey shade, 128 output column driver
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 and Appendix F of MIL-I-38535. Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated herein:
Outline letter Descriptive designator Terminals Package style Z See figure 1 190 Environmentally protected tape automated bond
The lead finish shall be as specified in Appendix F of MIL-I-38535 for all device classes.
Supply voltage ranges: VCC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7.0 V dc VEE - - - - - - - - - - - - - - - - - - - - - - - - - - -.- - - - - - - - - VCC + 0.3 V dc to VCC − 18.0 V dc Input voltage for DIO1, DIO2, D(0..5), FSTCHG, CLK, DST, RESET, SHFTUP, MODE1, MODE2, JTAG bus (VIND) - - - - - - - - - - - - - - - - - - - −0.3 V dc to VCC + 0.3 V dc Output voltage for DIO1, DIO2, JTAG bus (VOUTD) - - - - - - - - - - - - - - −0.3 V dc to VCC + 0.3 V dc Input voltage range for VLX - - - - - - - - - - - - - - - - - - - - - - - - - VCC + 0.3 V dc to VEE − 0.3 V dc Output voltage range for 01 - 0128 (VOUTA) - - - - - - - - - - - - - - - - - VCC + 0.3 V dc to VEE − 0.3 V dc Input current, VCC (IID) - - - - - - - - - - - - - - - - - - - - - - - - - - ±10 mA Output current for 01 - 0128 (IOUTA) 2/ - -- - - - - - - - - - - - - - - - - ±l2 mA Output current for DIO1, DIO2 (IOUTD) - - - - - - - - - - - - - - - - - - - - ±5 mA Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −55°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - +300°C Power dissipation (PD) 3/ Chip-on-tape: Maximum clock frequency - - - - - - - - - - - - - - - - - - - - - - - - - 370 mW Thermal resistance, case-to-ambient (θCA) - - - - - - - - - - - - - - - - - - 17.3°C/W Maximum die temperature rise for the die at 100% - - - - - - - - - - - - - - 4.7°c Current reference input range (IREFIN) - - - - - - - - - - - - - - - - - - - 20 µA to 200 µA
Supply voltage range: VCC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc VEE - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −9.75 V dc to −12.25 V dc Logic input voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - 0 V dc to +5.0 V dc Maximum clock frequency - - - - - - - - - - - - - - - - - - - - - - - - - - 15 MHz Maximum test clock frequency - - - - - - - - - - - - - - - - - - - - - - - - 7 MHz Output voltage swing - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±6 V dc Ambient operating temperature range - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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